A lead-free solder paste comprises an Sn-Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1 - 10.0 mass%. The flux may further include 0.5 - 20 mass% of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).
申请公布号
EP1317991(A3)
申请公布日期
2005.01.05
申请号
EP20020292989
申请日期
2002.12.04
申请人
SENJU METAL INDUSTRY CO., LTD;MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人
TAGUCHI, TOSHIHIKO;TAKAURA, KUNIHITO;HIRATA, M.;YOSHIDA, H.;NAGASHIMA, T.