Low temperature hot melt adhesive that is applied at or below 149 DEG C and that can withstand temperatures when bonded and stressed that are within 43 DEG C of their application temperature.
申请公布号
EP1493792(A2)
申请公布日期
2005.01.05
申请号
EP20040015388
申请日期
2004.06.30
申请人
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
发明人
GOOD, DAVID J.;MEHAFFY, JUSTIN A.;HANER, DALE L.;PATEL, JAGRUTI;MORRISON, BRIAN D.;WILLYBIRO, FIDELIN N.
