发明名称 |
Solid-state imaging device and method for manufacturing the same |
摘要 |
<p>A solid-state imaging device includes: a housing (1) having a base (2 )and a rectangular-frame-shaped rib (3) that are resin molded integrally; metal lead pieces (9) embedded in the housing, each of which has an internal terminal portion (9a) facing an internal space (4), an external terminal portion (9b) exposed on a bottom face, and a side electrode portion (9c) exposed on an external side face; an imaging element (5) fixed on the base; connection members (10) connecting electrodes of the imaging element and the internal terminal portions of the metal lead pieces, respectively; and a transparent plate (7) fixed on an upper end face of the rib. A thickness of each metal lead piece at a position of its internal terminal portion is substantially equal to a thickness of the base, and the external terminal portion is formed with a reverse face of the metal lead piece at a position corresponding to the internal terminal portion. In the resin molding, the internal terminal portion is pressed against the upper mold, whereby the occurrence of resin burrs is suppressed.</p> |
申请公布号 |
EP1494291(A2) |
申请公布日期 |
2005.01.05 |
申请号 |
EP20040015178 |
申请日期 |
2004.06.29 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MINAMIO, MASANORI;NISHIO, TETSUSHI;FUKUDA, TOSHIYUKI |
分类号 |
H01L27/14;H01L23/00;H01L23/02;H01L23/04;H01L23/08;H01L27/00;H01L27/146;H01L31/00;H04N3/14;H04N5/335;(IPC1-7):H01L27/146 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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