发明名称 CONDUCTIVE COMPOSITION, CONDUCTIVE FILM, AND PROCESS FOR THE FORMATION OF THE FILM
摘要 <p>A conductive composition capable of producing a conductive paint with excellent flexibility and a high conductivity comparable to that of metallic silver, without using high temperatures as film forming conditions. The conductive composition includes a particulate silver compound and a binder, and optionally a reducing agent and a binder. Silver oxide, silver carbonate and silver acetate and the like are used as the particulate silver compound. Ethylene glycol, diethylene glycol, and ethylene glycol diacetate and the like are used as the reducing agent, and a fine powder of a thermosetting resin such as a polyvalent phenol compound, phenol resin, alkyd resin or polyester resin, or a thermoplastic resin such as a styrene resin or polyethylene terephthalate, with an average particle diameter from 20 nm to 5 µm is used as the binder. Furthermore, the average particle diameter of the particulate silver compound is preferably from 0.01 to 10 µm.</p>
申请公布号 EP1493780(A1) 申请公布日期 2005.01.05
申请号 EP20030720898 申请日期 2003.04.09
申请人 FUJIKURA LTD.;FUJIKURA KASEI CO., LTD. 发明人 TAKAHASHI, KATSUHIKO;OHMORI, KIWAKO;ENDO, MASANORI;YASUHARA, HIKARU;IMAI, TAKAYUKI;ONO, AKINOBU;HONDA, TOSHIYUKI;OKAMOTO, KOJI;ITO, MASAFUMI
分类号 C08K3/08;C08K3/22;C08K3/26;C08L61/00;C08L63/00;C08L67/00;C09D5/24;C09J9/02;H01B1/22;H05K1/09;(IPC1-7):C08L101/00;H01B1/20;C08K5/00;C08K3/00 主分类号 C08K3/08
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