REPLACEMENT UNIT AND REPLACEMENT METHOD FOR SUBSTRATE IN THIN-FILM FORMING DEVICE

摘要

The present invention receives a film-coated substrate together with a carrier from a substrate replacing head which receives the substrate and carrier from a film forming device, while the substrate is transferred between the substrate replacing head and a stage on which the substrate is to be set; transfers only the substrate to the stage while the carrier is held; cools the carrier while it is held; then receives an uncoated substrate set on the stage by the carrier being held; and transfers the substrate and carrier to the film forming device by the substrate replacing head. This structure prevents temperature rise at the substrate being coated with a film to allow control of carrier temperature for a thin film forming process which uses a carrier for holding the substrate.