Solid-state imaging device and method for producing the same

摘要

A solid-state imaging device includes: a base 1 made of an insulation material and having a frame form in planar shape with an aperture 2 formed at an inner region; a plurality of wirings 4 provided on one surface of the base 1 and extending toward an outer periphery of the base from a region along the aperture; and an imaging element 5 mounted on the surface of the base with wirings provided thereon so that a light-receptive region 5a of the imaging element faces the aperture. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion 4a and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion 4b, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.