发明名称 |
Heat-curable resin composition and use thereof |
摘要 |
<p>The heat-curable resin composition of the present invention comprises an epoxy-containing resin and a curing agent, wherein the curing agent is cyclohexanetricarboxylic acid and/or an anhydride thereof. The heat-curable resin composition exhibits an excellent curability without using an curing accelerator and provides a colorless transparent cured product which is little discolored under high-temperature conditions and irradiation conditions of high-energy light. The heat-curable resin composition is suitable for producing coating compositions, adhesives, shaped articles, protective films for color filters and sealing materials for photosemiconductors such as blue LED and white LED.</p> |
申请公布号 |
EP1493766(A1) |
申请公布日期 |
2005.01.05 |
申请号 |
EP20040014662 |
申请日期 |
2004.06.23 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
IDENO, RYUJI;KOYAMA, TAKESHI;OKUO, MASAMI;MIBAE, SHIRO |
分类号 |
C08G59/42;(IPC1-7):C08G59/42 |
主分类号 |
C08G59/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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