| 摘要 |
A light emitting chip with heat dissipating structure, which emits light as electricity flows through and is applicable as the light source for LED. The light emitting chip is composed of epitaxy chip and electrodes, and uses insulating material with good heat-dissipation to form the substrate of the emission layer. To improve the heat dissipation rate, the substrate has plural openings filled with conducting metals, so the substrate has better heat conductivity and dissipation rate.
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