| 摘要 |
A cleaning apparatus of an electronic component of the present invention comprises: means for supplying cleaning water to an object to be cleaned such as alumina titanium carbide wafer, a sponge member for contacting with the object to be cleaned to clean a surface thereof, means for moving the object to be cleaned and the sponge member relative to each other, and means for adjusting the resistivity value of the cleaning water to 10MOmega or less. Using this apparatus, the object to be cleaned is cleaned using the sponge member while supplying, to the object to be cleaned, cleaning water having the resistivity value of 10MOmega or less. In this case, the cleaning degree is enhanced by soaking the object to be cleaned in the water having the resistivity value of 10MOmega or less before cleaning, and by using a dummy substrate.
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