| 发明名称 |
MEMS and MEMS components from silicon kerf |
| 摘要 |
The disclosure describes an economical and environmentally benign method for using crystalline silicon metal kerf recovered from wiresaw slurries towards the fabrication of complex MEMS and MEMS components, including MEMS packages, with improved design features.
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| 申请公布号 |
US6838047(B2) |
申请公布日期 |
2005.01.04 |
| 申请号 |
US20020231880 |
申请日期 |
2002.08.23 |
| 申请人 |
BILLIET ROMAIN LOUIS;NGUYEN HANH THI |
发明人 |
BILLIET ROMAIN LOUIS;NGUYEN HANH THI |
| 分类号 |
B22F3/16;B22F8/00;(IPC1-7):B22F3/16 |
主分类号 |
B22F3/16 |
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