发明名称 |
Oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition |
摘要 |
A solvent, such as deionized water, is heated up to boil to remove the oxygen dissolved in the water before preparing the plating solutions for the growth of copper interconnects. The resistance of the copper grown from the EDD solutions having undergone the oxygen-removing process is greatly improved, down to a value very close to copper's ideal value.
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申请公布号 |
US6838116(B2) |
申请公布日期 |
2005.01.04 |
申请号 |
US20030716550 |
申请日期 |
2003.11.20 |
申请人 |
FENG CHIA UNIVERSITY |
发明人 |
LIU DON-GEY;YANG TSONG-JEN;YANG CHIN-HAO;YANG WEN LUH;CHEN GIIN-SHAN |
分类号 |
C23C18/16;C23C18/38;(IPC1-7):B05D5/12;C25D5/54 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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