发明名称 |
Electronic component and method of producing the same |
摘要 |
An electronic component includes a laminate having a structure in which an element substrate and a sealing substrate are bonded to each other through an adhesive layer, a terminal electrode is arranged on the element substrate so as to be exposed at an end surface of the laminate, an outside electrode is disposed on the outer surface of the sealing substrate, the terminal electrode and the outside electrode are electrically connected to each other through an end surface electrode disposed on the end surface of the laminate, and the thickness of the end surface electrode is between about one half of the thickness of the adhesive layer and about five times of the thickness thereof.
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申请公布号 |
US6839243(B2) |
申请公布日期 |
2005.01.04 |
申请号 |
US20030372749 |
申请日期 |
2003.02.24 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KOTANI KENICHI;WAJIMA MASAYA |
分类号 |
H01L23/12;H01L23/02;H01L41/09;H01L41/22;H03H3/02;H03H9/02;H03H9/05;H03H9/10;H03H9/17;H03H9/54;H03H9/56;H05K1/03;H05K3/40;H05K3/46;(IPC1-7):H01R12/16 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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