MULTILAYERED ADHESIVE FILM FOR SEMICONDUCTOR DEVICE TO PREVENT DELAMINATION IN TERMS

摘要

PURPOSE: A multilayered adhesive film for a semiconductor device is provided, which prevents delamination in terms by increasing adhesive force in terms, thereby improving electrical properties of the semiconductor device. CONSTITUTION: The multilayered adhesive film comprises: a support layer(22) having a plurality of vias(24) passed through the support layer(22) in the width direction; an upper adhesive layer(21) attached to the upper face of the support layer(22); a lower adhesive layer(23) attached to the lower face of the support layer(22), wherein adhesives of the upper and lower adhesive layers(21)(23) are joined with each other through the vias(24). The via(24) has both open parts having larger diameters than the center part.