APPARATUS WITH THERMAL-CONDUCTIVITY PAD FOR INSPECTING SEMICONDUCTOR DEVICE WITHOUT DAMAGE

摘要

PURPOSE: An apparatus for inspecting a semiconductor device is provided to improve remarkably the reliability on a heat-resistance test of the device and to prevent efficiently damage of the device by using a thermal-conductivity pad. CONSTITUTION: An apparatus for inspecting a semiconductor device includes a match plate(20), a contact module, and a thermal-conductivity pad. The contact module includes a radiation part and a test part. The radiation part(30) is connected to the match plate and contacts a semiconductor device(70). The test part(40) is used for pressing a lead wire(72) of the semiconductor device. The thermal conductivity pad(60) is attached on the radiation part to conduct the heat of the semiconductor device to the radiation part. The thermal conductivity pad is made of ceramic-silicon composite materials.