| 摘要 |
A conductive particle can be used for connecting a variety of adherends. The conductive particle includes a resin particle, a first conductive particle disposed around the resin particle, a first resin coating disposed on the periphery of the resin particle. The first resin coating being softer than the resin particle. A second conductive thin film is disposed therearound. When the surface part of an electrode of an adherend that is to be connected is hard, a first resin coating of the conductive particle and the second conductive thin film are destroyed by pressure to bring the second conductive thin film in contact with the electrode and a metal wiring. If the surface part of the electrode is soft, the second conductive thin film on the surface side comes in contact with the electrode, which makes it possible for the particle to be used regardless of the surface state of an adherend. |
