SURFACE ACOUSTIC WAVE DEVICE HAVING AN ENOUGH MARGIN OF SEALING OF PACKAGE FOR THE DEVICE, AND METHOD OF FABRICATING THE DEVICE

摘要

PURPOSE: A surface acoustic wave device, a package thereof, and a fabricating method thereof are provided to prevent corrosion of an embossing tape in a transporting process by securing a sealing margin of the package. CONSTITUTION: A surface acoustic wave device includes a surface acoustic wave chip and a package. The surface acoustic wave chip includes a piezoelectric substrate(21), comb-like electrodes(22), and electrode pads(23). The comb-like electrodes and the electrode pads are formed on the piezoelectric substrate. The package(2) includes a cavity(4) housing the surface acoustic wave chip. A first surface of the package includes an opening of the cavity which is wider than a second surface of the package opposite to the first surface.