FILM CARRIER TAPE AND MANUFACTURING METHOD THEREOF PERFORMING APPLICATION OF SOLDER RESIST AFTER COATING LAYER FORMATION

摘要

PURPOSE: A film carrier tape and a manufacturing method thereof are provided to prevent erroneous results such as corrosion of an interconnection pattern or a lead breakage by applying a solder resist after forming a coating layer. CONSTITUTION: A film carrier tape includes an interconnection pattern(14), a first coating layer(18a), a second coating layer(18b), and a protection layer(16). The interconnection pattern is formed by etching a conductive layer from an insulating film(10). The first coating layer is formed at a surface exposure portion of the interconnection pattern and contains Sn. The second coating layer is formed on a surface exposure portion of the first coating layer and is configured not to contain Sn. The protection layer is formed on the second coating layer excluding a lead portion.