CHEMICAL MECHANICAL POLISHING APPARATUS PERFORMING POLISHING AND WAFER TRANSFERRING AT THE SAME TIME FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A chemical mechanical polishing apparatus for manufacturing semiconductor devices is provided to accelerate a process time by simultaneously performing a polishing process and a wafer transferring process. CONSTITUTION: A chemical mechanical polishing apparatus includes a polishing station(100), a plurality of polishing heads(300a,300b,300c,300d), a driver(242), and a transferring stage(120). The polishing station includes a plurality of flattens having polishing pads attached thereon. The plurality of polishing heads are implemented on an upper portion of the polishing station and include membranes for adsorbing wafers. The driver rotates the polishing head. The transferring stage is implemented on the polishing station to load/unload the wafer to/from the polishing head. The transferring stage includes a plurality of rotational transferring members(130).