| 摘要 |
<p>A procedure of continuous application of solder from a melt onto a copper strip is solving the problem of selective application of solder onto copper strips of various forms and line production of commutators without machining off excess solder, avoiding galvanic application at the same time. In the procedure of continuous application of solder from the melt onto a copper strip, the latter is travelling at a constant speed through a dosing chamber, where the contact with the solder melt is established. During the contact between the melt and the surface of the strip the copper strip is warmed up and wetted and binds a certain quantity of solder. The dosing chamber is a component of the soldering assembly which is also a melt holding trough and a melting aggregate at the same time. The melt from the holding trough is pushed from the bottom of the bath by means of a pressure stirrer, a pump or according to the principle of communicating vessels. The shape and size of the channel of the dosing chamber conform to the shape of the copper strip, shape of selective application of solder onto the copper strip surface and productivity of the procedure. The procedure of application of solder within the melt flow enables flexibility in productivity planning and application of solder as an independent technological operation or as a part of the continuous production of profile-rolled copper strips.</p> |
