| 发明名称 |
PROCESS FOR FORMING MOLDED HEAT DISSIPATION DEVICES. |
| 摘要 |
HEAT DISSIPATION DEVICES AND MOLDING PROCESSES FOR FABRICATING SUCH DEVICES.WHICH HAVE AT LEAST TWO REGIONS COMPRISING DIFFERENT COMDUCTIVE MATERIAL SUCH THAT EFFICIENT THERMAL CONTACT IS MADE BETWEEN THE DIFFERENT CONDUCTIVE MATERIALS.THE MOLDING PROCESSES INCLUDES INJECTION MOLDING AT LEAST TWO DIFFERING CONDUCTIVE MATERIALS. |
| 申请公布号 |
MY118674(A) |
申请公布日期 |
2004.12.31 |
| 申请号 |
MY2001PI04911 |
申请日期 |
2001.10.23 |
| 申请人 |
INTEL CORPORATION |
发明人 |
BENEFIELD, JOSEPH A. |
| 分类号 |
B22D17/00;B22D17/22;B22F7/06;B29C45/00;B29C45/16;B29L31/18;H01L21/48;H01L23/433 |
主分类号 |
B22D17/00 |
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