| 摘要 |
PURPOSE: A semiconductor device and an assembling method thereof are provided to prevent a breakdown of an insulating film having a low dielectric constant on a solder material without forming a void in a sealing resin. CONSTITUTION: A semiconductor device includes a chip mount substrate(1), inner electrode pads(2a,2b,2c,2d), a first solder ball(3a,3b,3d), a second solder ball(4a,4b,4c,4d), a semiconductor chip(6), and a sealing resin(7). The chip mount substrate includes a first side and a second side facing the first side. The inner electrode pads are implemented on the second side. The first solder ball is coupled with the inner electrode pads. The second solder ball has a melting point higher than that of the first solder ball. The semiconductor chip includes a third side having the inner electrode pads coupled with the second solder ball. The sealing resin serves as a flux sealed around the first and second solder balls. |
