| 发明名称 |
WINDOWED NON-CERAMIC PACKAGE HAVING EMBEDDED FRAME |
| 摘要 |
AN INTEGRATED CIRCUIT (IC) PACKAGE (50) INCLUDES A MOLD COMPOUND, A DIE (16), AND A WINDOW (34). THE MOLD COMPOUND HAS A FRAME EMBEDDED (300) WITHIN IT. THE FRAME (300) HAS A COEFFICIENT OF THERMAL EXPANSION THAT IS LESS THAN THE MOLD COMPOUND. THE IC PACKAGE IS CAPABLE OF BEING ATTACHED TO A CIRCUIT BOARD VIA A MASS REFLOW PROCESS.
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| 申请公布号 |
MY118657(A) |
申请公布日期 |
2004.12.31 |
| 申请号 |
MY1999PI05288 |
申请日期 |
1999.12.06 |
| 申请人 |
INTEL CORPORATION |
发明人 |
ZONG-FU LI;KABUL SENGUPTA;DEBORAH L. THOMPSON |
| 分类号 |
G02B5/20;H01L31/0203;H01L23/02;H01L23/22;H01L27/14;H01L27/146;H05K3/34 |
主分类号 |
G02B5/20 |
| 代理机构 |
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| 主权项 |
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