| 摘要 |
A METAL SURFACE, USUALLY COPPER, IS MICROROUGHENED TO IMPROVE ADHESION OF POLYMERIC MATERIALS, BY THE USE OF AN ADHESION-PROMOTING COMPOSITION COMPRISING HYDROGEN PEROXIDE, AN INORGANIC ACID, A CORROSION INHIBITOR WHICH IS FOR EXAMPLE A TRIAZOLE, TETRAZOLE OR IMIDAZOLE, AND A QUATERNARY AMMONIUM SURFACTANT. THE PROCESS IS OF PARTICULAR VALUE IN PRODUCTION OF MULTI-LAYER PRINTED CIRCUIT BOARDS TO PROMOTE INTERLAYER ADHESION.
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