| 发明名称 |
Flip chip packaging structure and related packaging method |
| 摘要 |
A bump is formed on a bonding pad provided on a substrate. A passivation film covering a bonding pad provided on a semiconductor chip is provided with two apertures in which bumps are formed. The bump provided on the substrate advances and enters into a clearance between these bumps provided on the semiconductor chip when the semiconductor chip is packaged with the substrate.
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| 申请公布号 |
US2004262753(A1) |
申请公布日期 |
2004.12.30 |
| 申请号 |
US20040874289 |
申请日期 |
2004.06.24 |
| 申请人 |
DENSO CORPORATION |
发明人 |
KASHIWAZAKI ATSUSHI |
| 分类号 |
H01L23/12;H01L21/60;H01L23/32;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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