发明名称 |
Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby |
摘要 |
Methods and apparatus that minimize the impedance discontinuity between a component and a signal trace is described. The methods and apparatus generally comprise at least one signal trace disposed on a dielectric layer, wherein the signal trace comprises a first width which is wider than a second width, a via connected to the first width of the signal trace, and a component electrically attached to the via, wherein an impedance discontinuity between the signal trace and the component is lowered.
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申请公布号 |
US2004263181(A1) |
申请公布日期 |
2004.12.30 |
申请号 |
US20030611791 |
申请日期 |
2003.06.30 |
申请人 |
YE XIAONING;MILLER DENNIS;BOLEN JERRY D. |
发明人 |
YE XIAONING;MILLER DENNIS;BOLEN JERRY D. |
分类号 |
G01R31/28;H05K1/02;H05K1/11;H05K3/42;(IPC1-7):G01R31/11 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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