发明名称 Terminal structure of multi-layer substrate and method for forming the same
摘要 Disclosed is a terminal structure of a multi-layer substrate and a method for forming the same. In the terminal structure, a plurality of terminals are formed on at least two adjacent substrate layers, each of the terminals being spaced from adjacent ones to a predetermined interval. Openings are formed in at least one of the substrate layers. Each of the openings is formed between each adjacent ones of first terminals in the at least one substrate layer, and spaced from the each first terminals to a predetermined gap, and has a size same as that of the first terminals. The substrate layers are stacked one atop another and compressed together so that second terminals formed on at least one corresponding substrate layer are projected to a plane of an outermost substrate layer on which corresponding terminals are formed. The terminal structure and the method can secure a predetermined interval to a plurality of terminals in a package when the terminals are formed as well as simplify formation thereof.
申请公布号 US2004262785(A1) 申请公布日期 2004.12.30
申请号 US20040791718 申请日期 2004.03.04
申请人 JUN SEOK TAEK 发明人 JUN SEOK TAEK
分类号 H01L23/12;H01L23/13;H01L23/498;H05K3/34;H05K3/46;(IPC1-7):H01L29/40 主分类号 H01L23/12
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