发明名称 Manufacture of thermal laminate and apparatus therefor
摘要 This invention relates to a method of manufacturing a thermal laminate by laminating a first substrate film layer and a second substrate film layer through an adhesive resin layer, which comprises integrating the adhesive resin layer with the first substrate film layer, heating the surface of the adhesive resin layer by heat rays in the presence of oxygen to induce functional groups which contribute to adhesion, and then, superimposing the second substrate film layer on the adhesive resin layer to be bonded thereto with pressure. The thermal laminate has a strong laminated strength without using solvent, and is excellent in safety and hygience of foods.
申请公布号 US2004261931(A1) 申请公布日期 2004.12.30
申请号 US20040832828 申请日期 2004.04.26
申请人 NARUMIYA TOSHIYUKI;ASANO ISAMU;KASAHARA HIROSHI;TANAKA RYOJI 发明人 NARUMIYA TOSHIYUKI;ASANO ISAMU;KASAHARA HIROSHI;TANAKA RYOJI
分类号 B29C65/48;B29C65/00;B29C65/02;B29C65/10;B29C65/14;B29L7/00;B29L9/00;B32B7/04;B32B7/12;B32B27/08;B32B27/32;B32B37/20;C08L23/00;C09J5/06;(IPC1-7):B32B31/00;B32B31/12 主分类号 B29C65/48
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