发明名称 Stacked capacitor and method for fabricating same
摘要 The invention relates to a stacked capacitor (10) comprising a silicon base plate (16), a poly-silicon center plate (32) arranged above the base plate (16), a lower gate-oxide dielectric (26) arranged between the base plate (16) and the center plate (32), a cover plate (36) made of a metallic conductor and arranged above the center plate (32), and an upper dielectric (34) arranged between the center plate (32) and the cover plate (36). The cover plate (36) and the base plate (16) are electrically connected to each other and together form a first capacitor electrode. The center plate (32) forms a second capacitor electrode. The invention further relates to an integrated circuit with such a stacked capacitor, as well as to a method for fabrication of a stacked capacitor as part of a CMOS process.
申请公布号 US2004264100(A1) 申请公布日期 2004.12.30
申请号 US20040830629 申请日期 2004.04.22
申请人 BALSTER SCOTT;EL-KAREH BADIH;STEINMANN PHILIPP;DIRNECKER CHRISTOPH 发明人 BALSTER SCOTT;EL-KAREH BADIH;STEINMANN PHILIPP;DIRNECKER CHRISTOPH
分类号 H01L21/02;H01L27/06;H01L27/08;(IPC1-7):H01G4/30 主分类号 H01L21/02
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