| 发明名称 |
METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS |
| 摘要 |
A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.
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| 申请公布号 |
US2004266159(A1) |
申请公布日期 |
2004.12.30 |
| 申请号 |
US20030604164 |
申请日期 |
2003.06.28 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GARDECKI LEONARD J;PALMER JAMES R;PROBSTFIELD ERIK M;WIRSING ADOLF E |
| 分类号 |
H01L21/60;(IPC1-7):H01L21/48;H01L21/44;H01L21/50 |
主分类号 |
H01L21/60 |
| 代理机构 |
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