发明名称 |
Printed circuit board and method for fabricating the same |
摘要 |
A printed circuit board and a method for fabricating the same is provided. A substrate having a core layer and a plurality of pairs of bond pads thereon is prepared with at least one opening formed on the core layer between each pair of the bond pads. A solder mask layer covers the core layer and fills the openings, with recessed portions formed at positions of the solder mask layer on the openings during curing of the solder mask layer. When a small passive component is mounted on the printed circuit board, a space is formed between the bottom of the passive component and the recessed portions of the solder mask layer. An encapsulating resin can flow into the space to form an insulating barrier between the bond pads to prevent bridging between the bond pads and short circuiting of the passive component.
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申请公布号 |
US2004262033(A1) |
申请公布日期 |
2004.12.30 |
申请号 |
US20040831247 |
申请日期 |
2004.04.23 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
CHIU CHIN-TIEN;CHANG CHIN-HUANG;HUANG CHIH-MING |
分类号 |
H05K3/28;H05K3/30;(IPC1-7):H05K1/03 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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