发明名称 System and method for cutting and applying metal configurations to another metal surface
摘要 A method and system for rigidly connecting a first metallic plate to a second metallic plate are provided. The first plate over the second plate, and a force is applied to at least one first location of the first plate using a clamping arrangement so as to tightly couple the first plate to the second plate in a proximity of the first location. Then, the beam source is caused to generate a beam to irradiate the first plate at the first location to produce a molten material. In this manner, at least one irradiated section of the first plate is melted throughout its thickness and rigidly connected to the second plate using the molten material. During the irradiation, the first plate and the clamping arrangement are translated with respect to one another to reach at least one second location. It is also possible to provide a bonding layer or a soldering layer between the first and second layers, which can be used to rigidly connect the first and second layers to one another. Further, it is possible to simultaneously cut a section of the first layer, and weld it to the second layer.
申请公布号 US2004262271(A1) 申请公布日期 2004.12.30
申请号 US20040499753 申请日期 2004.06.18
申请人 CHEN MEIR 发明人 CHEN MEIR
分类号 B23K26/02;B23K26/14;B23K26/22;B23K26/24;B23K26/38;B23K26/42;B23K37/04;(IPC1-7):B23K26/20 主分类号 B23K26/02
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