发明名称 Multilayer flexible circuit board, has opposing flexible conducting structures forming electrical contact region, and upper/lower threads connecting opposing conducting structures in shape-locking manner
摘要 <p>The multilayer flexible circuit board has opposing flexible conducting structures (8) that form an electrical contact region and upper and lower threads (3,4) connect the opposing conducting structures in a shape-locking manner. The opposing conducting structures are mechanically deformed and implemented so as to make electrical contact.</p>
申请公布号 DE202004017377(U1) 申请公布日期 2004.12.30
申请号 DE20042017377U 申请日期 2004.11.02
申请人 KSW MICROTEC AG 发明人
分类号 H05K1/11;H05K3/32;H05K3/40;(IPC1-7):H05K1/14;H05K1/02 主分类号 H05K1/11
代理机构 代理人
主权项
地址