发明名称 |
Multilayer flexible circuit board, has opposing flexible conducting structures forming electrical contact region, and upper/lower threads connecting opposing conducting structures in shape-locking manner |
摘要 |
<p>The multilayer flexible circuit board has opposing flexible conducting structures (8) that form an electrical contact region and upper and lower threads (3,4) connect the opposing conducting structures in a shape-locking manner. The opposing conducting structures are mechanically deformed and implemented so as to make electrical contact.</p> |
申请公布号 |
DE202004017377(U1) |
申请公布日期 |
2004.12.30 |
申请号 |
DE20042017377U |
申请日期 |
2004.11.02 |
申请人 |
KSW MICROTEC AG |
发明人 |
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分类号 |
H05K1/11;H05K3/32;H05K3/40;(IPC1-7):H05K1/14;H05K1/02 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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