发明名称 |
Electronic component module |
摘要 |
An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.
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申请公布号 |
US2004264156(A1) |
申请公布日期 |
2004.12.30 |
申请号 |
US20040829272 |
申请日期 |
2004.04.22 |
申请人 |
TDK CORPORATION |
发明人 |
AJIOKA ERIKO;ASAMI SHIGERU;SHIMODA HIDEAKI;IKEDA HIROSHI;YAMASHITA YOSHINARI;KURATA HITOYOSHI |
分类号 |
H01L23/552;H01L23/66;H01L25/04;H01L25/16;H01L25/18;H05K1/02;H05K1/14;(IPC1-7):H05K9/00 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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