发明名称 Silicon nitride film, a semiconductor device, a display device and a method for manufacturing a silicon nitride film
摘要 The present invention provides a method for forming by plasma CVD a silicon nitride film that can be formed over heat-sensitive elements as well as an electroluminescent element and that has favorable barrier characteristics. Further, the present invention also provides a semiconductor device, a display device and a light-emitting display device formed by using the silicon nitride film. In the method for forming a silicon nitride film by plasma CVD, silane (SiH4), nitrogen (N2) and a rare gas are introduced into a deposition chamber in depositing, and the reaction pressure is within the range from 0.01 Torr to 0.1 Torr.
申请公布号 US2004262613(A1) 申请公布日期 2004.12.30
申请号 US20040873285 申请日期 2004.06.23
申请人 MAEKAWA SHINJI;KAKEHATA TETSUYA;TAKEHARA YUUICHI 发明人 MAEKAWA SHINJI;KAKEHATA TETSUYA;TAKEHARA YUUICHI
分类号 C23C16/34;H01L21/318;H01L27/32;H01L51/00;H01L51/52;(IPC1-7):H01L29/04 主分类号 C23C16/34
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