发明名称 Laser beam machining device
摘要 A laser material processing apparatus for processing a workpiece (22) in such a way as to separate one laser light (26) into two laser beams (26a, 26b) via first polarizing means (25), one laser beam being passed via the mirrors (24), the other laser beam being scanned biaxially by a first galvano scanner (29), and conduct two laser beams (26a, 26b) to second polarizing means (27) for scanning via a second galvano scanner (30), wherein an optical path is constituted such that the laser beam (26b) transmitted through the first polarizing means (25) is reflected by the second polarizing means (27), and the laser beam (26a) reflected by the first polarizing means (25) is transmitted through the second polarizing means (27).
申请公布号 US2004262275(A1) 申请公布日期 2004.12.30
申请号 US20040495781 申请日期 2004.05.17
申请人 KUROIWA TADASHI;IJIMA KENICHI;KOBAYASHI NOBUTAKA 发明人 KUROIWA TADASHI;IJIMA KENICHI;KOBAYASHI NOBUTAKA
分类号 B23K26/067;B23K26/38;(IPC1-7):B23K26/067 主分类号 B23K26/067
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