Bump structure of a semiconductor wafer and manufacturing method thereof

摘要

A bump structure is applicable for disposing above a semiconductor wafer, which has a plurality of bonding pads and a passivation exposing the bonding pads on which a plurality of patterned under bump metallurgy layers are formed. It is characterized that the bump structure is made of a first bump and a second bump, and the bump structure is disposed on one of the patterned under bump metallurgy layer wherein the second bump covers the first bump and the melting point of the second bump is below the melting point of the first bump. In addition, a manufacturing method of the bump structure is provided.