METHOD OF MANUFACTURING HEAT CONDUCTIVE SUBSTRATE

摘要

Preparation of a heat conductive substrate comprises forming a conductor for forming circuits by processing a metal plate to have a specific shape, applying a film on the assembling side, forming a laminate on the side of the assembly surface and the reverse side by adhering an integrate product of heat curing composition in the form of a bendable sheet and a heat releasing plate, filling the thorough holes by heating and pressurising so that the heat curing composition is in a semi-cured state, curing the composition completely, and then curing the film completely. Independent claims are also included for (1) a similar preparation wherein the heat curing composition sheet and heat releasing plate are laminated in order on the assembly side of the conductor, (2) a similar method wherein a conductor is formed containing an electrically independent line and a connection part, applying a first film on the assembling side and reverse side, removing the film from the connecting part, applying second film on the assembling side and peeling the first film on the reverse side and then the laminate is formed and so on, and (3) a similar preparation incorporating (1) and (2).