| 摘要 |
Lead-free solder alloys based on a Sn-Ag-Mg system are disclosed. The alloy compositions have a melting temperature close to 183° C. and a similar surface tension to that of Sn-Pb solder, and can thus be a readily substituted for conventional Sn-Pb solders. P may be added to the alloy compositions to reduce its tendency of oxidation. |
