MATERIAL INCLUDING A LIQUID CRYSTALLINE POLYMER AND A POLYHEDRAL OLIGOMERIC SILSESQUIOXANE (POSS) FILLER

摘要

Use of liquid crystalline polymers together with polyhedral oligomeric silsesquioxane (POSS) fillers either in place of or together with conventional fillers yields improved dielectric materials for circuits. POSS-filled systems typically exhibit lower mass densities and greater stiffness, and are capable of withstanding higher temperatures, as well as higher levels of ionizing radiation. In addition, POSS-filled polymers are capable of wetting fibers and fillers to desirably high degrees. They may also help to minimize polymerization shrinkage, lower viscosity and increase material toughness.