发明名称 |
Semiconductor device, semiconductor module and hard disk |
摘要 |
The back surface of a semiconductor chip (16) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this semiconductor chip (16). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the metal plate (23) and the second supporting member (24). <IMAGE> <IMAGE> <IMAGE> |
申请公布号 |
EP1195812(A3) |
申请公布日期 |
2004.12.29 |
申请号 |
EP20010302532 |
申请日期 |
2001.03.20 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
SAKAMOTO, NORIAKI;KOBAYASHI, YOSHIYUKI;SAKAMOTO, JUNJI;OKADA, YUKIO;IGARASHI, YUSUKE;MAEHARA, EIJU;TAKAHASHI, KOUJI |
分类号 |
H01L23/28;H01L21/48;H01L23/12;H01L23/29;H01L23/36;H01L23/42;H01L23/433;H01L25/04;H01L25/18;H05K1/02;H05K1/18 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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