3-D SHAPE MEASURING UNIT, PROCESSING UNIT, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

摘要

A production method for a semiconductor device capable of concurrently measuring a plurality of points on a sample to achieve a fast 3-D shape measurement, and reflecting it in the setting of processing conditions in a semiconductor production process to enable the stable production of a high-accuracy device. A 3-D shape measuring unit which is mounted on a processing unit such as an etcher, a coating developer, a baking furnace, and an exposure system, and which measures a plurality of measuring points (500) on a sample (300) at a high speed by the collaboration of a plurality of arranged measuring heads (100) that measure the 3-D shape of a sample and a moving loader/stage (200) mounting the sample (300) thereon. This measuring result is used to perform feedback control for correcting processing conditions for the subsequent sample (300) and feedforward control for correcting processing conditions in the next step.