| 发明名称 |
CONDUCTIVE RESIN MOLDING |
| 摘要 |
A conductive resin molding is formed by molding a resin composition, which comprises a thermoplastic resin and graphite and contains 1 - 9 vol.% (based on 100 vol% of the resin composition) of high boiling point oil. The high boiling point oil is at least one oil selected from aromatic hydrocarbon oils and silicone oils. |
| 申请公布号 |
EP1491589(A1) |
申请公布日期 |
2004.12.29 |
| 申请号 |
EP20020705308 |
申请日期 |
2002.03.18 |
| 申请人 |
NTN CORPORATION |
发明人 |
EGAMI, MASAKI;SHIMAZU, EIICHIROU |
| 分类号 |
H01M8/02;C08J5/00;C08K3/04;C08L101/00;H01B1/24;H01M2/16;H01M8/10 |
主分类号 |
H01M8/02 |
| 代理机构 |
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代理人 |
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