METHOD FOR BONDING TOGETHER TWO SUBSTRATES, METHOD FOR DISASSEMBLING SAID BONDED ASSEMBLY AND PRIMER THEREFOR
摘要
The invention concerns a method for assembling a first substrate (10) and a second substrate (12) by bonding with a joint (14). The invention is characterized in that it consists in successively performing the following steps: applying on the first substrate (10) an adhesive primer (18) with controlled disassembling capacity comprising a polymer base and at least one agent for degrading the bonding of said primer with the first substrate or for degrading the primer in the volume; providing a polymer material joint between the first and the second substrate (12); pressing the two substrates (10, 12) against each other; and polymerizing the joint (14) to obtain a bonded assembly of the two substrates (10, 12). The invention also concerns the related primer.
申请公布号
WO2004087829(A3)
申请公布日期
2004.12.29
申请号
WO2004FR50126
申请日期
2004.03.25
申请人
RESCOLL;ALCORTA, JOSE;PAPON, ERIC;VILLENAVE, JEAN-JACQUES;DALET, PIERRE
发明人
ALCORTA, JOSE;PAPON, ERIC;VILLENAVE, JEAN-JACQUES;DALET, PIERRE