A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.
申请公布号
WO2004113446(A2)
申请公布日期
2004.12.29
申请号
WO2004US18520
申请日期
2004.06.10
申请人
GENERAL ELECTRIC COMPANY;GALLUCCI, ROBERT, RUSSELL;OLDLE, ROY, RAY;KERNICK, WILLIAM, A., III;SANNER, MARK, ALAN
发明人
GALLUCCI, ROBERT, RUSSELL;OLDLE, ROY, RAY;KERNICK, WILLIAM, A., III;SANNER, MARK, ALAN
