A semiconductor sensor which is capable of preventing damage to a diaphragm section and capable of easy etching is obtained. Elongated connecting surfaces (15) are formed, each extending between adjacent two of the four inclined surfaces (13) and along the boundary between the two inclined surfaces so as to connect the two inclined surfaces. A diaphragm (11) is formed with thick portions (17) projecting from the back of the diaphragm (11) in the vicinity of the ends of the connecting surfaces (15).
申请公布号
WO2004114416(A1)
申请公布日期
2004.12.29
申请号
WO2004JP08626
申请日期
2004.06.18
申请人
HOKURIKU ELECTRIC INDUSTRY CO.,LTD.;HIROSE, SHIGERU;ICHII, TOSHIAKI;HIRAKI, TOSHIYUKI;KOMORI, KAZUYA;MINAMI, MASAYOSHI