Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same,申请号EP20000121429-传众专利搜索

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发明名称	Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same
摘要
申请公布号	EP1088615(B1)	申请公布日期	2004.12.29
申请号	EP20000121429	申请日期	2000.09.29
申请人	NEC TOPPAN CIRCUIT SOLUTIONS, INC.;SOLDER COAT CO., LTD.	发明人	ITO, TOSHIHIDE;HARA, SHIRO
分类号	B23K35/26;C22C13/00;H05K3/24;H05K3/34;(IPC1-7):B23K35/26	主分类号	B23K35/26
代理机构		代理人
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