发明名称 POSITIVE RESIST COMPOSITION
摘要 <p>A positive resist composition which comprises (A) a base resin component having an acid-dissociative dissolution inhibiting group and increasing in the solubility into an alkaline solution, and (B) a component generating an acid by the irradiation with a radiation, wherein the (A) component exhibits an absorbance at 193 nm of 1.0 (1/mum) or less and has a molecular weight distribution (Mw/Mn) of 1.5 or less. The positive resist composition exhibits excellent resolving characteristics and a wide PEB margin.</p>
申请公布号 WO2004114022(A1) 申请公布日期 2004.12.29
申请号 WO2004JP08785 申请日期 2004.06.16
申请人 TOKYO OHKA KOGYO CO., LTD.;HAYASHI, RYOTARO;IWAI, TAKESHI 发明人 HAYASHI, RYOTARO;IWAI, TAKESHI
分类号 G03F7/26;G03F7/039;C08F220/10;H01L21/027;(IPC1-7):G03F7/039 主分类号 G03F7/26
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