发明名称 |
POSITIVE RESIST COMPOSITION |
摘要 |
<p>A positive resist composition which comprises (A) a base resin component having an acid-dissociative dissolution inhibiting group and increasing in the solubility into an alkaline solution, and (B) a component generating an acid by the irradiation with a radiation, wherein the (A) component exhibits an absorbance at 193 nm of 1.0 (1/mum) or less and has a molecular weight distribution (Mw/Mn) of 1.5 or less. The positive resist composition exhibits excellent resolving characteristics and a wide PEB margin.</p> |
申请公布号 |
WO2004114022(A1) |
申请公布日期 |
2004.12.29 |
申请号 |
WO2004JP08785 |
申请日期 |
2004.06.16 |
申请人 |
TOKYO OHKA KOGYO CO., LTD.;HAYASHI, RYOTARO;IWAI, TAKESHI |
发明人 |
HAYASHI, RYOTARO;IWAI, TAKESHI |
分类号 |
G03F7/26;G03F7/039;C08F220/10;H01L21/027;(IPC1-7):G03F7/039 |
主分类号 |
G03F7/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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