摘要 |
<p>There is provided and apparatus and method for electrostatically applying a powder material to substrates. The apparatus includes a plurality of platens, each platen being arranged to hold a plurality of substrates, a conveyor for conveying the platens along a path and an applicator for applying the powder material to the substrates. The method includes the steps of placing the substrates on platens, each platen holding a plurality of substrates, conveying the platens in series along a path and electrostatically applying a powder material to the substrates held on the platens. There is also provided a platen for holding a plurality of substrates to which powder material is to be electrostatically applied, the platen comprising a platen base having a plurality of supports for supporting a plurality of substrates and an electrically conducting platen shield located on the platen base and having a plurality of holes arranged to align with the plurality of supports on the platen base.</p> |
申请人 |
PHOQUS PHARMACEUTICALS LIMITED;NEWMAN, MICHAEL;IMPEY, BENJAMIN;HENLEY, THOMAS;JENNINGS, DOUGLAS;HALLETT, MARTIN |
发明人 |
NEWMAN, MICHAEL;IMPEY, BENJAMIN;HENLEY, THOMAS;JENNINGS, DOUGLAS;HALLETT, MARTIN |