Method and apparatus for force transfer via bare die package

摘要

The present application describes a method and an apparatus for facilitating increased uniformity and diffusion of force transfer on a bare die electronic package for example, when such electronic package is attached to a circuit board. Additional force absorbent material is applied around a bare die in the bare die electronic package. The force applied to the bare die electronic package can be distributed to the additional force absorbent material. A curable force absorbent material is dispensed around the bare die in the bare die electronic package. The surface of the curable material is substantially parallel with the surface of bare die thus facilitating a substantially uniform force distribution through the bare die and curable material resulting in a robust bare die electronic package.