| 摘要 |
An interposer has a connection electrode formed on a surface of an insulating substrate, and a solder bump of a semiconductor chip connects to the connection electrode. The surface of the insulating substrate is roughened, and the connection electrode easily peels off from the surface of the insulating substrate. When thermal stress occurs between the semiconductor chip and the interposer, the thermal stress allows the connection electrode to peel off from the surface of the insulating substrate at the connection area with the solder bump to bring it into a floating state, and the thermal stress is absorbed due to elastic deformation of the connection electrode.
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